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authorDavid Phillips <david@sighup.nz>2019-05-31 21:58:10 +1200
committerDavid Phillips <david@sighup.nz>2019-05-31 22:09:32 +1200
commita73063c4da5b3d818251334c249e4941e762a0e9 (patch)
tree9f10388fd901d8741e1cde8029a8d7db79622f6e
parentacbfbe0cd8654f316550b56d2d7954805f34698a (diff)
downloadled-driver-a73063c4da5b3d818251334c249e4941e762a0e9.tar.xz
Reduce clearances, margin on MSOP footprint
Reduction of the soldermask margin allows soldermask to be placed between the landing pads for the leads, which should aid soldering. Reduction of the pad clearance should stop DRC from complaining about nets too close together.
-rw-r--r--led-driver.kicad_pcb4
1 files changed, 3 insertions, 1 deletions
diff --git a/led-driver.kicad_pcb b/led-driver.kicad_pcb
index 62b1aca..1a855f4 100644
--- a/led-driver.kicad_pcb
+++ b/led-driver.kicad_pcb
@@ -913,6 +913,8 @@
(descr "MSE Package; 10-Lead Plastic MSOP, Exposed Die Pad (see Linear Technology 05081664_I_MSE.pdf)")
(tags "SSOP 0.5")
(path /59AEF993)
+ (solder_mask_margin 0.04)
+ (clearance 0.09)
(attr smd)
(fp_text reference U1 (at 0 3.048 180) (layer B.SilkS)
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
@@ -1323,7 +1325,7 @@
(gr_text "Vf: 37V\nIf: 450 mA" (at 179.07 107.315) (layer B.SilkS) (tstamp 59B0E864)
(effects (font (size 1 1) (thickness 0.2)) (justify left mirror))
)
- (gr_text "Const. Current LED Driver\nVer 1 (May 2019)\nDavid Phillips\nhttps://nah.nz/" (at 179.07 101.6) (layer B.SilkS)
+ (gr_text "Const. Current LED Driver\nVer 1.1 (May 2019)\nDavid Phillips\nhttps://nah.nz/" (at 179.07 101.6) (layer B.SilkS)
(effects (font (size 0.7 0.7) (thickness 0.15)) (justify left mirror))
)
(gr_text LED (at 154.432 114.3) (layer F.SilkS) (tstamp 59B0E7F6)