From a73063c4da5b3d818251334c249e4941e762a0e9 Mon Sep 17 00:00:00 2001 From: David Phillips Date: Fri, 31 May 2019 21:58:10 +1200 Subject: Reduce clearances, margin on MSOP footprint Reduction of the soldermask margin allows soldermask to be placed between the landing pads for the leads, which should aid soldering. Reduction of the pad clearance should stop DRC from complaining about nets too close together. --- led-driver.kicad_pcb | 4 +++- 1 file changed, 3 insertions(+), 1 deletion(-) diff --git a/led-driver.kicad_pcb b/led-driver.kicad_pcb index 62b1aca..1a855f4 100644 --- a/led-driver.kicad_pcb +++ b/led-driver.kicad_pcb @@ -913,6 +913,8 @@ (descr "MSE Package; 10-Lead Plastic MSOP, Exposed Die Pad (see Linear Technology 05081664_I_MSE.pdf)") (tags "SSOP 0.5") (path /59AEF993) + (solder_mask_margin 0.04) + (clearance 0.09) (attr smd) (fp_text reference U1 (at 0 3.048 180) (layer B.SilkS) (effects (font (size 1 1) (thickness 0.15)) (justify mirror)) @@ -1323,7 +1325,7 @@ (gr_text "Vf: 37V\nIf: 450 mA" (at 179.07 107.315) (layer B.SilkS) (tstamp 59B0E864) (effects (font (size 1 1) (thickness 0.2)) (justify left mirror)) ) - (gr_text "Const. Current LED Driver\nVer 1 (May 2019)\nDavid Phillips\nhttps://nah.nz/" (at 179.07 101.6) (layer B.SilkS) + (gr_text "Const. Current LED Driver\nVer 1.1 (May 2019)\nDavid Phillips\nhttps://nah.nz/" (at 179.07 101.6) (layer B.SilkS) (effects (font (size 0.7 0.7) (thickness 0.15)) (justify left mirror)) ) (gr_text LED (at 154.432 114.3) (layer F.SilkS) (tstamp 59B0E7F6) -- cgit v1.1